Chipbond Technology Corporation
Manufacturer of Solder Bumps.
Company Information
Company Introduction :
The company's products including wafer bumping, tape carrier packaging (TCP), flip chip, wafer level CSP, gold bump, solder bump, chip on film.
Main Products :
electronic & electrical components- wafer bumping, tape carrier packaging ( TCP), flip chip, wafer level CSP, gold bumps, solder bumps, chip on films.
Other Information :
| Business Nature : | Manufacturer |
|---|---|
| Year Established : | 1997 |
| Company Capital : | USD 100,000,001 ~ |
| Annual Revenue : | USD 100,000,001 ~ |
| President : | Mr. Fei Jian Wu |
| No. of Total Staff : | 2001 ~ 3000 |
| Current Export Markets : | Worldwide |
| Trade Term : | FOB |
| Shipment : | Sea |
| Currency : | USD |
| Negotiable : | Negotiable |
Chipbond Technology Corporation
- Taiwan