Chipbond Technology Corporation
Manufacturer of Solder Bumps.
Taiwan
Company Introduction
The company's products including wafer bumping, tape carrier packaging (TCP), flip chip, wafer level CSP, gold bump, solder bump, chip on film.
Main Products
electronic & electrical components- wafer bumping, tape carrier packaging ( TCP), flip chip, wafer level CSP, gold bumps, solder bumps, chip on films.