Company Introduction :
The company's products including wafer bumping, tape carrier packaging (TCP), flip chip, wafer level CSP, gold bump, solder bump, chip on film.
Main Products :
electronic & electrical components- wafer bumping, tape carrier packaging ( TCP), flip chip, wafer level CSP, gold bumps, solder bumps, chip on films.
Other Information :
| Business Nature : | Manufacturer |
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| Year Established : | 1997 |
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| Company Capital : | USD 100,000,001 ~ |
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| Annual Revenue : | USD 100,000,001 ~ |
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| President : | Mr. Fei Jian Wu |
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| No. of Total Staff : | 2001 ~ 3000 |
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| Current Export Markets : | Worldwide |
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| Trade Term : | FOB |
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| Shipment : | Sea |
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| Currency : | USD |
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| Negotiable : | Negotiable |
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