Description :

Application:for chips terminal dipping of passive components
Carrier:Thin Carrier Plate series, TCP
Chips:0201, 0402, 0603, 0805 and above
Capacity:Depends on chips’ specification which will affect capacity. For example, the capacity of chip 0402 (1005mm) is about 826 K/hr.

Specification :

Operational Process

1. Put the TCP on machine by labor.
2. Use vacuum approach to put TCP through the chips dipping process
3. For chips below 0603 (1608), suitable single side chip dipping manufacturing process; for chips above 0603 (1608), suitable two sides chip dipping manufacturing process and unnecessary to transfer.

Technical precision

1. Paste thickness precision:±0.01mm
2. Action precision: ±0.002mm
3. Ink tray plate flatness: ±0.005mm
4. The parallelism tolerance between dipping plate and ink tray: ±0.005mm
5. Adjustable Ink tray thickness:±0.001mm

Machine specification

1. Dimension: 2650 (L)*1200 (W) *2100 mm (H)
2. Weight: 1380 Kgs

Electric Control

1. Controller: PLC, HMI, Servo Motor…
2. Voltage: 3ψ220V(380V), customable
3. Electric current: 20(A), depending on voltage.
4. Power consumption: 4.4(KW)
5. Frequency: 50/60Hz
6. Air Consumption: 32 (l/min)

If you need more detail specification and function in advance, please contact us.

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