Description :

Application:for chips terminal dipping of passive components
Carrier:Thin Carrier Plate series, TCP
Chips:0201, 0402, 0603, 0805 and above
Capacity:Depends on chips’ specification which will affect capacity. For example, the capacity of chip 0402 (1005mm) is about 826 K/hr.

Specification :

Operational Process

1. Put the TCP on machine by labor.
2. Use vacuum approach to put TCP through the chips dipping process
3. Suitable for single side/two-side chip dipping manufacturing process.

Technical precision

1. Paste thickness precision:±0.01mm
2. Action precision: ±0.002mm
3. Ink tray plate flatness: ±0.005mm
4. The parallelism tolerance between dipping plate and ink tray: ±0.01mm
5. Adjustable Ink tray thickness:±0.001mm

Machine specification

1. Dimension: 4930 (L)*1960 (W) *2691 mm (H)
2. Weight: 4000 Kgs

Electric Control

1. Controller: PLC, HMI, Servo Motor…
2. Voltage: 400V, customable
3. Electric current: 25A, depending on voltage.
4. Power consumption: 17.5(KW)
5. Frequency: 50/60Hz
6. Air Consumption: 360 (l/min)

If you need more detail specification and function in advance, please contact us.

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