Description :

1. Multi-layers with buried and blind via.
2. Surface: HASL, immersion gold, entek,etc.
3. Solder mask: green, white, yellow or red,etc.
4. Standard FR1, FR2, FR4/ CEM1 and CEM3.
5. Apply to computer & device/ medical equipment/ domestic/ communication/ automotive.

Specification :

1. Single side and double side, multi-layers up to 12 layers.

2. Thickness: 0.1mm to 3.0mm.

3. Minimum track width/ space: 0.1mm.

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  General Material PCBs ( Printed Circuit Boards )