Description :

For high integrity electronic applications:
1. Protection from water, humidity, dirt, dust and other environmental hazards.
2. Resistance to abrasion, reversion, chemicals, fungus and thermal shock.
3. Excellent dielectric properties.
4. Room temperature curing, UV curing.
5. Positive adhesion-uniform films-easy repairability.

Specification :

1. Material: two-liquid.

2. Viscosity(cps): 72.

3. Refers to the dry time 25℃: 5hr.

4. Hardening time 25℃/60℃: 5day/ 3hr.

5. Temperature limit(℃): -65~ 125.

6. Solvent limit: premium.

• 
  Triple Insulation Wires
• 
  Tooling Resins