Description :

Might integrates quality ISO & TS certified systems and innovative assembly and packaging technologies to deliver market-leading consumer electronic products.

Specification :

Might SMT & Thru-hole lines utilize the most advanced technologies in the industry including: 1. Flip chip technologies. 2. 0201, Micro BGA, AI, thru-hole assembly. 3. Lead-free solder technology. 4. Alternative PCB (printed circuit board) finishes.