Golobemaster Technologies Co., Ltd.
Manufacturer of Electronic, Electrical Parts & Components.
Detail Information
Description :
Material:
1. Housing: thermoplastic, UL94V-0 rated.
2. Contact: copper alloy.
3. Ped: copper alloy.
Specification :
Contact:
1. IP underplating: 1.27μm (50u") min Nickel overall
2. IP contact area: gold plating Over 1.27μm (50u") Nickel underplate.
3. IP solder tail: 2.54μm (100u") min. Sn/Pb over Ni underplate
4. Ped: 2.54μm (100u") min. Su / Pb over 1.27μm(50u") min. Ni underplate overall
Golobemaster Technologies Co., Ltd.
- Taiwan